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    DSAH00467111.pdf

    • Philips Semiconductors
    • INTEGRATED CIRCUITS SL1 ICS30 01 Bumped I·CODE1 Label IC (IC with Bumps) Chip Specification Product Specification Revision 2.1 Public April 2000 Philips Semiconductors I·CODE1 Chip Specif
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    ELECTROGLAS APPLICATIONS - WAFER TEST DATA FILE

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