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    DSASL00157994.pdf

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    • Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS 621/623 SERIES Footprint Dimensions in. (mm) Height in. (mm) Mounting Hole Pattern 4.750 (120.6) x 1.500 (38.1) 4.7
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    DSASL00157994.pdf preview Download Datasheet

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