Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSA00101680.pdf

    • Xilinx
    • 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM 0 Packages and Thermal Characteristics R February 15, 2000 (Version 2.1) 0 8* Package Information Inches vs. Millimeters
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DSA00101680.pdf preview Download Datasheet

    User Tagged Keywords

    AUGAT DIP SOCKETS BAV 235 BGA 31 x 31 mm BGA and QFP Package CB228 fine BGA thermal profile footprint jedec MS-026 TQFP footprint jedec MS-026 TQFP 128 HQ160 HQ208 HQ240 land pattern for TSOP land pattern for TSOP 2 land pattern for TSOP 2 86 land pattern for TSOP 2 86 PIN leadframe C7025 MO-143-GA MO-143-JA MO-83-AF OPQ0019 PQ100 PQ160 PQ208 PQ240 PQ304 QFP PACKAGE thermal resistance QFP PACKAGE thermal resistance die down schematic impulse sealer TQ100 TSOP 86 land pattern VQ100 xc4010e-pq208 Yamaichi vq100
    Price & Stock Powered by Findchips

    Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel