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DSASW00211545.pdf
Manufacturer
Infineon Technologies
Partial File Text
T-M3.2 Wire Bond Globe Top Package For contact based application (Memory) Sh o rt Pro d u c t O ve r vi e w May 2010 Ch i p C a rd & Se c u ri t y T-M3.2 T-M3.2 Short Product Overvie
Datasheet Type
Original
ECAD Model
Part Details
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User Tagged Keywords
iso 10373-1
iso 7810
iso iec 7810
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