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    ScansUX1700.pdf

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    • DALLAS SEMICONDUCTOR DS2009 512x9 FIFO Chip FEATURES • First-in, first-out memory-based architecture • Flexible 512 x 9 organization • Low-power HCMOS technology • Asynchronous and simultaneou
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    DS2009 DS2009-35 DS2009-50 DS2009-65 DS2009-80 DS2013
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