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DSAZSAA00020025.pdf
Manufacturer
NXP Semiconductors
Partial File Text
Package outline TFBGA176: plastic thin fine-pitch ball grid array package; 176 balls; body 6 x 15 x 0.7 mm B D SOT932-1 A ball A1 index area E A2 A A1 detail X e1 1/2 e
Type
Original
ECAD Model
Part Details
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