DSAZSAA00020025.pdf

Manufacturer NXP Semiconductors
Partial File Text Package outline TFBGA176: plastic thin fine-pitch ball grid array package; 176 balls; body 6 x 15 x 0.7 mm B D SOT932-1 A ball A1 index area E A2 A A1 detail X e1 1/2 e
Type Original
ECAD Model
Part Details Part pricing, stock, data attributes from Findchips.com

DSAZSAA00020025.pdf preview Download Datasheet