Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSASW00135459.pdf

    • Central Semiconductor
    • PROCESS CPZ18 Zener Diode 0.5 Watt Zener Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 13.8 x 13.8 MILS Die Thickness 7.5 MILS Anode Bonding Pad Area 7.5
    • Original
    • Price & Stock Powered by Findchips

    DSASW00135459.pdf preview Download Datasheet

    Supplyframe Tracking Pixel