Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSAZSAA00020270.pdf

    • NXP Semiconductors
    • Reflow soldering footprint Footprint information for reflow soldering of HXQFN60U package SOT1134-1 4.1 2.5 1 0.5 0.585 (4×) 0.25 0.56 (4×) 0.525 (4×) 4.5 3.6 0.25 3
    • Original
    • Price & Stock Powered by Findchips

    DSAZSAA00020270.pdf preview Download Datasheet

    Newly Added Datasheets | Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel