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DSAUTAZ0017410.pdf
Manufacturer
Xilinx
Partial File Text
0 R Packages and Thermal Characteristics 0 11* February 2, 1999 (Version 2.1) Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define pack
Type
Original
ECAD Model
Part Details
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