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    DSA00160697.pdf

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    • HIGH DENSITY PACKAGE APPLICATIONS FOR WIRE BOND AND FLIP CHIP: SMALL, FINE PITCH BGA PACKAGES Mark J. Kuzawinski International Business Machines Corp. Endicott, New York Biography Mark Kuzawi
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    DSA00160697.pdf preview Download Datasheet

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    22-N-4 ultra fine pitch BGA
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