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    DSAZSAA00019494.pdf

    • NXP Semiconductors
    • Package outline HVQFN36: plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 6 x 6 x 0.85 mm A B D SOT1092-3 terminal 1 index area E A A1 c
    • Original
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    DSAZSAA00019494.pdf preview Download Datasheet

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