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    DSASW00419407.pdf

    • X-FAB Semiconductor Foundries
    • 1.0 µm BCD Process XDM10 MIXED-SIGNAL FOUNDRY EXPERTS Modular 1.0µm 350V Trench Insulated BCD Process Thick SOI material together with area efficient deep trench insulation allows the design
    • Original

    DSASW00419407.pdf preview Download Datasheet

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    "X-Fab" nd25c ND32A XDM10

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