DSAZSAA00020354.pdf
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NXP Semiconductors
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Reflow soldering footprint
Footprint information for reflow soldering of plastic surface-mounted package; 5 leads
SOT353
2.65
0.5 0.6
(4Ã) (4Ã)
0.75
0.4
2.35
0.75
0.5
(4Ã)
0
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Original
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Part pricing, stock, data attributes from Findchips.com
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