The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSA0034916.pdf
Manufacturer
Motorola
Partial File Text
Ceramic Ball Grid Array Packaging, Assembly & Reliability Andrew Mawer, Terry Burnette, Thomas Koschmeider and Diane Hodges Final Manufacturing Technology Center Motorola Semiconductor Products S
Type
Original
ECAD Model
Part Details
Part pricing, stock, data attributes from Findchips.com
DSA0034916.pdf preview
Download Datasheet
User Tagged Keywords
90Pb 10Sn solder paste
BGA and QFP Package ibm
BGA cte
BGA OUTLINE DRAWING
BGA PROFILING
BGA PROFILING leaded
bga rework
BGA Solder Ball collapse
CBGA motorola
ceramic rework
fine BGA thermal profile
hot air bga
motorola ltcc
MPC105
MPC106
MPC107
MPC107 RELIABILITY
pcb warpage in ipc standard
reflow hot air BGA
thermocouple WELD
Price & Stock Powered by
Findchips