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DSAQ00374036.pdf
Manufacturer
Techspray
Partial File Text
Silicone Free Heat Sink 1978 Heat sink draws heat away when applied to a component. In electronics, heat sink compound is generally used to thermally bond a component with a mechanical heat sink. Fo
Type
Original
ECAD Model
Part Details
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DSAQ00374036.pdf preview
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User Tagged Keywords
00840600-5000P
00840600-5002P