Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSADIGA000109419.pdf

    • Bergquist
    • Gap Pad 3000S30 ® Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material Features and Benefits • Thermal conductivity: 3.0 W/m-K • Low “S-Class” thermal resistance a
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DSADIGA000109419.pdf preview Download Datasheet

    Price & Stock Powered by Findchips
    Supplyframe Tracking Pixel