DSAZSAA00016836.pdf
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NXP Semiconductors
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Package outline
DIP24: plastic dual in-line package; 24 leads (600 mil)
SOT101-1
ME
seating plane
D
A2
L
A
A1
c
e
Z
b1
w M
(e 1)
b
MH
13
24
pin 1 in
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Original
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