DSADA00325.pdf by Agilent Technologies

Partial File Text HB2A Process Reliability Summary (Heterojunction Bipolar Transistor IC Process) Application Note # 53 - Rev. A Marketing March 1999 1.0 Introduction Included in this application note are re
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DC-20 GaAs MMIC ESD, Die Attach and Bonding Guidelines MTTF testing TC200 TC200 agilent