DSAASSA0009270.pdf by Philips Semiconductors

Partial File Text Prediction of high cycle fatigue in aluminum bond wires: A physics of failure approach combining experiments and multi-physics simulations Jeroen Bielen, Jan-Joris Gommans, Frank Theunis Philips Semi
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Coffin-Manson Equation copper bond wire igbt thermal characterization and simulation using ansys s-n curve