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    DSAASSA0009320.pdf by NXP Semiconductors

    • Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm D B A SOT618-1 terminal 1 index area E A A1 c detail X e1 e
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    DSAASSA0009320.pdf preview

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