DSAASSA0009345.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted package; 3 leads SOT416 2.2 1.7 0.85 0.5 (3×) 1 2 0.6 (3×) 1.3 solder land plus sold
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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DSAASSA0009345.pdf preview Download Datasheet