DSAASSA0009381.pdf by NXP Semiconductors

Partial File Text Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package; 3 leads 2.2 1.2 (2×) SOT23 1.4 (2×) 4.6 2.6 preferred transport direction during sol
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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DSAASSA0009381.pdf preview Download Datasheet