DSAASSA0009383.pdf by NXP Semiconductors

Partial File Text Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package with increased heatsink; 4 leads 8.9 6.7 SOT223 1.9 4 6.2 8.7 preferred transport dir
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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