DSAASSA0009386.pdf by NXP Semiconductors
- Wave soldering footprint Footprint information for wave soldering of TSOP6 package 5.3 SOT457 1.5 (4×) 1.475 5.05 1.475 0.45 (2×) 1.45 (6×) 2.85 solder land occupied area solder resis
- Original
- Unknown
- Unknown
- Unknown
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