DSAZIHA1000199429.pdf by Toshiba

Partial File Text Preliminary THGBM3G4D1FBAIG TOSHIBA e-MMC Module 2GB THGBM3G4D1FBAIG INTRODUCTION THGBM3G4D1FBAIG is 2-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is util
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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eMMC data retention emmc jedec P-TFBGA153-1113-0 THGBM THGBM3G THGBM3G4D1FBAIG Toshiba BGA 224 Toshiba emmc toshiba emmc boot Toshiba emmc performance Toshiba NAND BGA 224