DSADA0023101.pdf by Philips Semiconductors

Partial File Text PDF: 2003 Mar 17 Philips Semiconductors Package outline HBCC24: plastic thermal enhanced bottom chip carrier; 24 terminals; body 4 x 4 x 0.65 mm b1 x B D SOT564-1 v M C A B w
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock Find it at Findchips.com

DSADA0023101.pdf preview

Download Datasheet

User Tagged Keywords

Price & Stock Powered by