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    DSADA0023106.pdf by Philips Semiconductors

    • PDF: 2003 Jul 17 Philips Semiconductors Package outline TFBGA144: plastic thin fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.8 mm SOT569-1 B D A D1 ball A1
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    MO-216 TFBGA144
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