DSADA0023180.pdf by Philips Semiconductors

Partial File Text PDF: 2001 Dec 13 Philips Semiconductors Package outline HBGA388: plastic thermal enhanced ball grid array package; 388 balls; body 35 x 35 x 1.75 mm; heatsink SOT636-1 B D A D
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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MS-034 SOT636-1

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