DSAUTAZ009204.pdf by Maxim Integrated Products

Partial File Text Application Note: HFAN-08.1 Rev 0; 11/01 Thermal Considerations of QFN and Other Exposed-Paddle Packages Note: This application note is a summary and compilation of information based on the re
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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AN569 Motorola QFN PACKAGE Junction to PCB thermal resistance