DASF0026143.pdf by Maxim Integrated Products

Partial File Text Application Note: HFAN-08.1 Rev.1; 04/08 Thermal Considerations of QFN and Other Exposed-Paddle Packages Note: This application note is a summary and compilation of information based on the
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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"thermal via" Amkor Electronics Amkor Technology 1999 AN569 HFAN-08-1 JESD51-1 JESD51-2 JESD51-3 JESD51-4 QFN PACKAGE Junction to PCB thermal resistance SLMA002 thermal analysis on pcb

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