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    DSAUD0079975.pdf by NXP Semiconductors

    • AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 2 -- 15 April 2011 Application note Document information Info Content Keywords LPC175x, LPC176x, LPC177x, LPC178x, LPC181x
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    AN10778 JEDEC bga case outline land pattern for TSOP 2 54 pin LBGA256 LFBGA256 LFBGA324 LPC175x LPC178 LPC185 LPC2220 LPC2292 LPC2364 LPC2368 LPC2458 LPC2468 LPC2468 reflow solder profile LPC2470 LPC2478 LPC2478 pcb LPC2880 LPC2888 LPC3130 lpc433x MO-216 MO-275 NXP lpc nxp lpc175x pcb design 0,5 mm pitch PCB layout guidelines for NXP MCUs in BGA packages SOT950-1 TFBGA-296 TSOP 54 land pattern via antipad pitch
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