DSA00269206.pdf by Central Semiconductor

Partial File Text PROCESS CP229 Small Signal Transistors NPN - RF Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 21.7 x 21.7 MILS Die Thickness 8.7 MILS Base Bonding Pad
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSA00269206.pdf preview

Download Datasheet

User Tagged Keywords

2N5109 chip die npn transistor chip die transistor CP229 NPN planar RF transistor