DSA00269326.pdf by Central Semiconductor

Partial File Text PROCESS CPQ057 TRIAC 2.0 Amp, 600 Volt TRIAC Chip PROCESS DETAILS Process Glass Passivated Mesa Die Size 57 x 57 MILS Die Thickness 8.6 MILS ± 0.6 MILS MT1 Bonding Pad Are
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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6 amp 600 volt triac CPQ057 CQ223-2M CQ89-2M CQ92-2M Triac triac 4 amp 600 volt triac datasheet

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