DSA0079861.pdf by Aeroflex

Partial File Text Standard Products RadHard Eclipse FPGA Advanced Data Sheet August, 2004 www.aeroflex.com/RadHardFPGA FEATURES 0.25µm, five-layer metal, ViaLink epitaxial CMOS process for smallest die sizes O
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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