DSA0079862.pdf by Aeroflex

Partial File Text Standard Products RadHard Eclipse FPGA Advanced Data Sheet September, 2004 www.aeroflex.com/RadHardFPGA FEATURES 0.25µm, five-layer metal, ViaLink epitaxial CMOS process for smallest die sizes
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSA0079862.pdf preview

Download Datasheet

User Tagged Keywords

CERAMIC QUAD FLATPACK CQFP 96