DSACRA00005725.pdf by Xilinx

Partial File Text 100% Material Declaration Data Sheet FF484 PK402 (v1.2) September 28, 2012 Average Weight: 4.1856g Component Silicon Die (FPGA) Doped silicon Solder Bump Tin Lead Die Underfill Bisphenol F-type l
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock Find it at Findchips.com

DSACRA00005725.pdf preview

Download Datasheet

User Tagged Keywords

FF484

Price & Stock Powered by