DSACRA00005727.pdf by Xilinx

Partial File Text 100% Material Declaration Data Sheet FFG1923 PK463 (v1.1) September 28, 2012 Average Weight: 28.1214g Component Silicon Die (FPGA) Solder Bump Tin (Sn) Lead (Pb) Die Underfill Bisphenol F-type li
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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