DSACRA00006435.pdf by Xilinx

Partial File Text PK394 (v1.1) January 16, 2012 100% Material Declaration Data Sheet for XC3S1400AN FGG676 Package Average Weight: 3.188g Component Silicon Die (FPGA) Silicon Die (PROM) Substance Description
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
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