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DASF0036442.pdf
by Ironwood Electronics
Partial File Text
connected to H2 15.37mm [0.605"] 1.18mm [0.047"] BGA package outline 3.48mm [0.137"] A1 16.48mm [0.649"] Top View 1 1.00mm 1.59mm [0.063"] Bottom View 1 Substrate:
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RoHS
Unknown
Pb Free
Unknown
Lifecycle
Unknown
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14X14
BGA PACKAGE OUTLINE