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    DASF0036442.pdf by Ironwood Electronics

    • connected to H2 15.37mm [0.605"] 1.18mm [0.047"] BGA package outline 3.48mm [0.137"] A1 16.48mm [0.649"] Top View 1 1.00mm 1.59mm [0.063"] Bottom View 1 Substrate:
    • Original
    • Unknown
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    DASF0036442.pdf preview

    User Tagged Keywords

    14X14 BGA PACKAGE OUTLINE
    Supplyframe Tracking Pixel