DSA0038828.pdf by Intersil

Partial File Text Thermal Characterization of Packaged Semiconductor Devices ® Technical Brief December 2002 TB379.3 Author: Jim Benson Introduction With the continuing industry trends towards smaller
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conductivity meter circuit JC JB jt JEDEC JESD51-8 JEDEC JESD51-8 BGA JEP-140 JEP140 JESD51-1 JESD51-10 JESD51-3 JESD51-5 JESD51-6 JESD51-7 JESD51-9 Reliability Test Methods for Packaged Devices TB379 thermal resistance standards Theta JB

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