DSASW00107566.pdf by Altera

Partial File Text PROCESS CHANGE NOTIFICATION PCN0407 UFBGA 88 PACKAGE SUBSTRATE CHANGE Change Description: The substrate for the 88 Lead Ultra FineLine BGA® package assembled by Sharp will change from polyimide
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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EPC16UC88 EPC16UC88AA FR4 epoxy FR4 substrate PCN0407 Substrate

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