DSA003224.pdf by KOA Speer Electronics

Partial File Text RESISTORS TECHNOLOGY OF TOMORROW FLAT CHIP ENHANCED THICK FILM RK73G STRUCTURE 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Top termination (Ag Pd) Bottom termination (Ag Pd) Resistive layer Glass la
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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