DSA003225.pdf by KOA Speer Electronics

Partial File Text CAPACITORS TECHNOLOGY OF TOMORROW MULTILAYER CERAMIC CHIP Y5V t C STRUCTURE 1 2 3 4 5 Sn plating Ni plating Inner electrode (Pd/Ag) Internal electrode Dielectric ceramic layer W L I
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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