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DSASW006250.pdf
Manufacturer
Renesas Technology
Partial File Text
Renesas Technology Starts Sample Shipments of SH-Mobile G3 System LSI Jointly Developed with NTT DoCoMo, Fujitsu, Mitsubishi Electric, Sharp, and Sony Ericsson for 3G Mobile Phone Handsets Single-
Datasheet Type
Original
ECAD Model
Part Details
Part pricing, stock, data attributes from Findchips.com
DSASW006250.pdf preview
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User Tagged Keywords
3G HSDPA
GSM 3G HSDPA
HSDPA
mobile ics
mobile phone
sh-mobile
symbian
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