DSAE0012115.pdf by Hittite Microwave

Partial File Text v00.0206 C-1 CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-1 Package Outline Drawing NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVARTM 2. SPACER MATERIAL: ALUMINUM 3. PLATING: ELE
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSAE0012115.pdf preview

Download Datasheet

User Tagged Keywords