DSA0018776.pdf by Fujitsu

Partial File Text BALL GRID ARRAY PACKAGE 256 PIN PLASTIC BGA-256P-M04 Lead pitch 50mil Pin matrix 20 Sealing method 256-pin plastic T-BGA Plastic mold (BGA-256P-M04) 256-pin plastic T-BGA
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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