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DSASW00186962.pdf
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Stacked MCP Stacked Multi-Chip Package (Stacked MCP) is one of the most suitable chip scale packages for wireless applications. Its advantage is the compact stacked chip configuration. In the Flash
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DSASW00186962.pdf
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32M X 32 MEMORY
BGA NAND Flash
BGA PACKAGE thermal profile
BGA-56P-M01
FBGA56
FBGA69
FBGA71
FLASH BGA
MCP NAND
NAND FLASH BGA
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