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    DSASW00186964.pdf

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    • PLASTIC BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 484 PIN PLASTIC BGA-484P-M09 484-pin plastic TEBGA Ball pitch 1.00 mm Package width × package length 27.00 mm ×
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    DSASW00186964.pdf preview Download Datasheet

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    BGA-484P-M09

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