DSASW00187153.pdf by Fujitsu

Partial File Text BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M04 256-pin plastic T-BGA Lead pitch 1.27 mm Pin matrix 20 Sealing method Plastic mold
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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