DSASW00187166.pdf by Fujitsu

Partial File Text BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC BGA-420P-M02 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold (B
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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